Visakhapatnam Gears Up for 30th CII Partnership Summit

Visakhapatnam Gears Up for 30th CII Partnership Summit

Visakhapatnam is getting a major makeover ahead of the 30th CII Partnership Summit on November 14 and 15. The Andhra Pradesh government plans to use the event to attract investors and showcase the state’s rapid industrial growth.

At the curtain-raiser, IT and Industries Minister Nara Lokesh said the state will sign 410 MoUs worth ₹9.8 lakh crore during the summit. These projects are expected to create about 7.5 lakh jobs. He added that Andhra Pradesh is on track to meet its goal of generating 20 lakh jobs within five years. A senior official said the state has already drawn investments of nearly $120 billion in the past 17 months.

The government will also lay foundation stones for projects worth ₹2.7 lakh crore. These are expected to create another 2.5 lakh jobs. Mr. Lokesh described the event as a “three-way partnership” between people, government, and industry. He confirmed that Union Ministers Nirmala Sitharaman, Piyush Goyal, and Ashwini Vaishnaw will attend, along with delegates from 45 countries.

The summit returns to Visakhapatnam after seven years. The Union Government is supporting the event, while Mr. Lokesh and a group of ministers are supervising preparations to ensure smooth execution.

Investor confidence has grown after the state held roadshows across India and in cities such as London, Dubai, Tokyo, Paris, and Singapore. Chief Minister N. Chandrababu Naidu said Andhra Pradesh is focused on the “speed of doing business” through real-time governance.

The city is upgrading roads, public spaces, and hospitality facilities for the summit. Organizers plan to showcase local cuisine, Araku Coffee, and Kondapalli Toys. Recent mega projects, including Google’s $15 billion AI Data Centre with Airtel and the Adani Group, along with ventures by TCS, Cognizant, and ArcelorMittal-Nippon Steel, have strengthened Andhra Pradesh’s investment appeal.

Share this Post
0
0

Leave a Reply

Your email address will not be published. Required fields are marked *